S1: AR coating; Tx > 98%@1290~1315nm;
S5: polished, HR Coating, AOI: 35+/-0.05deg; Rp > 98%, Rs > 99% @ 1290~1315nm;
S2: polished, no coating;
Side S3 & S4: frosted;
Chamfering is not necessary on the sides or corners, Chips < 0.1mm; S/D: MIL 40-20. Scratch Width < 21um;
Incident light angle cone：+/-5deg;
Visual inspection under the bulb of 100W, dust free, ESD environment
No glue overflows from the bonding surface.